3DI / TSV Wafer Process Development Engineer in Singapore - Micron Semiconductor Asia Pte Ltd - E3284A

As a 3DI/TSV Wafer Process Development Engineer with the Advanced Packaging R&D Team at Micron Technology, your focus will be on laser dicing of DRAM die. You will be a part of the 3DI/TSV process team dedicated to vertical stacked memory die products. You will have an excellent understanding and experience with laser ablation and alternative laser dicing equipment and processes. (SUCCESSFUL CANDI...