FSL Frontend Packaging Engineer (Die Bond
Freescale Semiconductor - Petaling Jaya, SGR
FSL Frontend Packaging Engineer (Die Bond Process)
Job ID: 61996
Location: MALAYSIA - PETALING JAYA
Job Interest: Mechanical Engineering
Position Type: Full-time experienced
Relocation Available:
Required Education: Bachelors / Degree
Required Experience: 3 - 5...
715 days ago from Freescale Semiconductor
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