Packaging Engineer
Altera - Malaysia, Penang, MYS
Packaging Engineer
Location: Malaysia-Penang
Requisition ID: 1732
# of openings: 1
Description
As an Advance Package Design Engineer, you will:
· Be responsible for advance substrate design from scratch to final release and CAD documentation, interfacing with internal engineering as well as external supplier
· Package design experience in high density wirebonded BGA, flipchip BGA, high pi...
94 days ago from Altera
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