Singapore Technology Center (STC) R&D TSV
Micron Semiconductor Asia Pte Ltd
Micron’s Singapore Technology Center R&D group is looking for senior/principal process integration engineer for local positions to support R&D activities associated with rapid deployment of “Through Silicon Via” (TSV) technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming TSV technology nodes. Advertise...
74 days ago from Jobstreet Singapore
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