Additional Work Location(s) : Shenzhen, China
This position will report to Director, HW Engineering.
What You Will Do
Responsible for design of headphone/wearable hardware on component or module level, based on design specifications in accordance with the functional specifications.
Carry out feasibility study on new products against requirements, assist in defining a feasible architecture/concept and create a realistic development plan.
Ensure product quality from ODM/OEM meets Harman standard and requirements, comply Harman documentation structure, standards and design rules in project execution.
Lead the team to achieve assigned design goal in time.
Train and coach junior engineers to achieve high level of technical competence.
What You Need
University degree in Electronics Engineering or equivalent
Over 12 years of working experience in design, development, and manufacturing of consumer electronic audio and wearable products.
Experience in the noise cancellation headphone design
Experience in the RF design for wearable product
Experience in integrating and troubleshooting DSP audio is a plus
Proficient in the use of electronic test equipment (AP/Audio analyzers, Digital analyzers, oscilloscopes, spectrum and network analyzers).
Familiar with electronic schematic capture, layout and electronic simulation software tools.
Knowledgeable about signal integrity concepts such as: propagation, losses, parasitic, reflections, xtalk, ground bounce, power delivery and bypassing techniques for power/ground noise reduction, termination techniques for reflection noise control, IBIS modeling for SI simulation
Experience with Frequency domain analysis for signaling and power delivery as well as understanding the sources of jitter and noise reduction techniques, EMI suppression techniques.
Familiar with IEC, EIA, EIAJ formats and UL, CSA, IEC safety standards.
Familiar with antenna simulation, design, tuning and validation and cross body RF test