Radar Packaging Project Leader

NXP Semiconductors Netherlands BV (Nijmegen GE, Nederland) 14 dagen geleden gepost

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.

Do you have a background relative to packaging in the semiconductor world?

Are you able to drive innovation as a Project Manager?

The Package Innovation organization is responsible for the design of new packaging products and the development of new packaging technologies and assembly processes. It partners with all of the businesses of NXP Semiconductors to deliver the right package for each market and application.

Package Innovation is a multi-national organization. Development in our case means working together in teams with business lines, internal factories and subcontractors and suppliers across the globe.

Packaging is becoming more and more a challenging and demanding. Our customers in both the Automotive as well as the Security& connectivity domain are raising the bar continuously. While packages go down in cost and size our customers demand faster time to market and absolute quality. In this space the package is not only an envelope to protect the silicon from the environment and allow it to be mountable in the application, it is a clear value add.

For our integral RF Packaging program for our Business Line RFP, we are looking for Project Lead for RF Packaging project management, located in Nijmegen/The Netherlands. You will have the opportunity to take the lead in shaping our radar packaging projects and hence NXP’s Automotive business from a Technology Innovation point of view. With your knowledge and experience you will provide Best-in-Class Technology in all aspects – Quality, Performance, Integration and Cost of Ownership, while cooperating with the Business Line, OSATs and customers on a global scale.

Key responsibilities

  • Drive and Execute car radar packaging development projects with all its sub projects globally for Business Line RFP. The project is about development of advanced wafer level chip scale packaging processes in combination with RF requirements in the GHZ range (80 Ghz) to meet the requirements for next generation products of BL RFP
  • Responsible for definition and execution; on time delivery and quality of deliverables.
  • Organize team meetings to keep track of progress and report out in different levels of the organization.
  • Request resources from line managers from CTO/Operations:  Package Innovation and Manufacturing and Business Line IDA to get required allocation of resources.
  • Actively manage stakeholders, i.e. adjacent NXP business Lines, NXP internal and external factories that are on various locations and time zones; Nijmegen, Toulouse, Portugal, USA and Asia.

Requested profile

  • Degree qualified in Mechanical Engineering, Physics or Industrial/Process Engineering
  • Experienced in managing large-scale (outsourced) projects or programs relating to Semiconductor product (PMP preferred).
  • 5+ years additional experience in a Semiconductor Packaging  Development or Manufacturing environment (ideally related to Radar RF products within Automotive), Program Management  and Innovation experience.
  • Experience in six sigma, statistics and 8D methodology would be an asset.
  • Excellent communicator, influencer and networker. Self-starter with strong leadership and command skills.

What’s next:

If you are as excited about this opportunity as we are, we kindly invite you to apply. After a screening based on your profile, you can be expected to have a phone interview with our Talent Acquisition Consultant followed by several business interviews.

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Radar Packaging Project Leader

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