Job Summary:
An assembly process engineer develops, monitors, and optimizes post-wafer manufacturing operations—such as wafer dicing, chip packaging, wire bonding, and final testing. They troubleshoot assembly line defects, improve production yield, and test new packaging materials to ensure high reliability and low cost.
- Process Optimization: Fine-tune back-end operations like sawing, flip-chip bonding, die bond, wirebond, molding, and ball grid array (BGA) packaging.
- Yield & Quality Control: Track defect rates using Statistical Process Control (SPC) and failure analysis tools to fix line issues.
- Experimentation (DOE): Run Design of Experiments to test new materials, tooling changes, or recipe updates.
- Cross-Functional Support: Work with equipment technicians, test engineers, and R&D teams to launch new package designs.
- Documentation: Write clear standard operating procedures (SOPs) and material specifications.
Requirements:
· University/College and above in related field.
· 3+ years of manufacturing experience at Engineer level.
· Good knowledge in interpersonal communication.
· Able to lead and motivate subordinates to achieve organizational goals.
· Able to plan and execute plans effectively.
· Possesses sound knowledge on relevant company policies and regulations.
· Effective team building.
· Possess effective analytical and decision-making skills.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
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