Hong Kong Applied Science and Technology Research Institute (ASTRI) is founded in 2000 by the Government of the Hong Kong Special Administrative Region. As Hong Kong’s largest government-funded research and development centre, ASTRI is a key force and super‑connector driving innovation and technology advancement in Hong Kong, the Greater Bay Area, and the global innovation ecosystem. This role is strengthened through its merger with Nano and Advanced Materials Institute (NAMI).
Committed to bringing high‑impact research from lab to market, ASTRI advances interdisciplinary, market‑driven R&D that delivers practical innovations for industry and meaningful benefits for society.
Its technological strengths and capabilities enable AI‑powered, cross‑disciplinary ICT and advanced materials solutions across Smart City, Financial Technologies, Digital Health and Life Sciences, New Industrialisation and Intelligent Manufacturing, Application‑Specific Integrated Circuits (ASIC) and Advanced Electronics, New Energy and Energy Storage, and Green and ESG Technologies.
Over the years, ASTRI has cultivated a strong pool of I&T talent and earned numerous international awards for its pioneering innovations and contributions to industry and the community. Following the merger with NAMI, ASTRI’s cumulative global patent portfolio has grown to over 1,500, with more than 2,200 technologies successfully transferred to industry.
With enhanced scale and capabilities, ASTRI is uniquely positioned to elevate Hong Kong’s innovation capacity, accelerate technology commercialisation, and drive societal and economic progress through world‑class applied research.
Job Responsibilities
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing, etc. for TGV (through-glass-via) and/or TSV (through-silicon-via) related applications
Work with product design and material development teams to develop optimal process window for engineering prototype build
Transfer technical solution to the customer and provide on‑site technical support
Perform ad hoc duties as assigned
Job Requirements
Bachelor's degree or above in Mechanical Engineering, Material Engineering, Chemical Engineering, or related disciplines.
2+ years experience in advanced packaging and process development; less experience will be considered as Engineer.
Good communication and interpersonal skills, a good team player.
Live the ASTRI values.
Compensation & Benefits
The appointment will be on renewable contract terms with a competitive salary and performance‑linked variable pay. Fringe benefits include paid leave, medical insurance coverage and contribution to MPF. The incumbent will normally work a five‑day week.
Equal Opportunities Employer
ASTRI is an Equal Opportunities Employer. Personal data provided by job applicants will be used exclusively for recruitment only. For details, please refer to ASTRI Privacy Policy Statement.
#J-18808-Ljbffr
or continue with email
Committed to bringing high‑impact research from lab to market, ASTRI advances interdisciplinary, market‑driven R&D that delivers practical innovations for industry and meaningful benefits for society.
Its technological strengths and capabilities enable AI‑powered, cross‑disciplinary ICT and advanced materials solutions across Smart City, Financial Technologies, Digital Health and Life Sciences, New Industrialisation and Intelligent Manufacturing, Application‑Specific Integrated Circuits (ASIC) and Advanced Electronics, New Energy and Energy Storage, and Green and ESG Technologies.
Over the years, ASTRI has cultivated a strong pool of I&T talent and earned numerous international awards for its pioneering innovations and contributions to industry and the community. Following the merger with NAMI, ASTRI’s cumulative global patent portfolio has grown to over 1,500, with more than 2,200 technologies successfully transferred to industry.
With enhanced scale and capabilities, ASTRI is uniquely positioned to elevate Hong Kong’s innovation capacity, accelerate technology commercialisation, and drive societal and economic progress through world‑class applied research.
Job Responsibilities
Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing, etc. for TGV (through-glass-via) and/or TSV (through-silicon-via) related applications
Work with product design and material development teams to develop optimal process window for engineering prototype build
Transfer technical solution to the customer and provide on‑site technical support
Perform ad hoc duties as assigned
Job Requirements
Bachelor's degree or above in Mechanical Engineering, Material Engineering, Chemical Engineering, or related disciplines.
2+ years experience in advanced packaging and process development; less experience will be considered as Engineer.
Good communication and interpersonal skills, a good team player.
Live the ASTRI values.
Compensation & Benefits
The appointment will be on renewable contract terms with a competitive salary and performance‑linked variable pay. Fringe benefits include paid leave, medical insurance coverage and contribution to MPF. The incumbent will normally work a five‑day week.
Equal Opportunities Employer
ASTRI is an Equal Opportunities Employer. Personal data provided by job applicants will be used exclusively for recruitment only. For details, please refer to ASTRI Privacy Policy Statement.
#J-18808-Ljbffr
Sign in
To continue your applicationor continue with email
By continuing you agree to our Terms & Privacy Policy.
Similar jobs
Show more
More from ASTRI - Hong Kong Applied Science and Technology Research Institute