Company & Role Vision
Core Responsibilities
Requirements
What We Offer
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We are a company focused on 6.78MHz high-frequency magnetic resonance wireless power transfer technology. We are looking for an exceptional research talent to lead the technical R&D and architecture development of our core hardware systems — starting from fundamental physics to tackle high-frequency distributed power-delivery systems, addressing the core range/endurance challenge in embodied intelligence applications.
Core Responsibilities
- Systematic R&D & Architecture: Lead hardware architecture research for distributed wireless charging systems, from electromagnetic field simulation/modeling through complex circuit implementation, solving electromagnetic coupling and phase synchronization across multiple power units.
- Key Technical Breakthroughs: Conduct deep research on loss control, magnetic coupling mechanism optimization, and system stability in high-frequency scenarios — particularly impedance matching and high-frequency electromagnetic shaping under variable-coupling conditions.
- Experimental Development & Optimization: Drive R&D outputs from theoretical prototypes to high-performance production samples, resolving key engineering challenges such as thermal management, EMI/EMC suppression, and system reliability.
- Frontier Technology Collaboration: Engage in deep technical exchange with core component suppliers (e.g., custom magnetic materials, third-generation semiconductor manufacturers) to ensure optimal component performance matching in R&D solutions.
Requirements
- Academic Background: Master's or PhD in Power Electronics, Electrical Engineering, Automatic Control, or a related field.
- Experience: 3+ years of power electronics R&D experience, with prior involvement in the design of complex power electronics systems.
- Technical Expertise:
- Proficient in various high-frequency power topologies (e.g., resonant converters, Class E/EF, DC-DC) and advanced control strategies.
- Deep understanding of GaN/SiC third-generation semiconductor applications, with hands‑on experience in 6.78MHz or other MHz‑level circuit design.
- Skilled in simulation tools such as MATLAB/Simulink, Maxwell, HFSS, or Spice for system-level and field-level simulation.
- Language: Fluent in Mandarin and English for technical communication and daily work.
- Traits: Entrepreneurial drive, able to independently tackle high-difficulty technical challenges, and strong hands‑on capability.
What We Offer
- Core R&D Ownership: Direct involvement in the commercialization of frontier technology, with a high degree of technical autonomy and research influence.
- Compensation: Competitive salary and benefits, year-end bonus, and core equity incentives.
- Global Environment: Access to a world-leading technology ecosystem, leveraging Hong Kong Science Park's strategic location.
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