- Develop, optimize, and transfer thin film deposition processes for EUV‑enabled DRAM technology
- Lead process characterization, troubleshooting, and defect reduction through VME
- Drive thin film roadmap activities aligned to future technology nodes
- Collaborate with internal teams and suppliers to mature equipment, chemistries, and process solutions
- Analyze large physical and electrical datasets and communicate clear recommendations
- PhD or MS with 4+ years of semiconductor experience in materials or process development
- Strong foundation in materials science, chemical reaction engineering, and thin film physics
- Hands‑on experience with patterning films such as photoresist, hard masks, and spacers
- Experience with ALD, CVD, PECVD, PE‑ALD, and/or LPCVD processes
- Knowledge of SPC and process maturity for manufacturable technologies
- Experience developing thin films specifically for EUV patterning environments
- Background with surface analysis techniques such as XPS, AFM, XRD, or SIMS
- Experience driving vendor equipment or process roadmaps
- Demonstrated leadership of cross‑functional or global development teams
- Strong ability to adapt and execute in a rapidly changing R&D environment
Semiconductor Process Engineer 4
Relocation LevelTBD
CompensationUS base salary range: $107,000.00 – $182,000.00 a year.
Additional compensation may include benefits, bonuses, and equity.
BenefitsMicron provides a choice of medical, dental, and vision plans, income‑protection programs, paid family leave, a robust paid time‑off program, and paid holidays.
EEO StatementMicron is proud to be an equal‑opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.
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