Job Title: R&D Power Module Section Manager
Job Summary
Our client is seeking an experienced R&D Power Module Section Manager to provide technical leadership for the development and manufacturing of advanced semiconductor power-module products. This position will coordinate cross-functional engineering activities, establish product and process-design standards, and drive improvements in quality, reliability, cost, and manufacturing performance.
Key Responsibilities
- Serve as the technical leader for power-module development and manufacturing activities.
- Coordinate with Process Engineering, Quality Assurance, Equipment Engineering, Product Management, Design Engineering, and other relevant teams.
- Establish product-design guidelines and design rules for power-module products.
- Define critical process parameters, control requirements, material-selection criteria, and package-reliability standards.
- Lead process-design, process-control, and manufacturing-readiness activities for new and existing products.
- Provide technical direction and resolve complex product, process, quality, and reliability issues.
- Review engineering data and ensure appropriate application of SPC, DOE, APQP, FMEA, and other quality methodologies.
- Communicate technical requirements, risks, and solutions to internal stakeholders and customers.
- Drive yield improvement, defect reduction, process optimization, and operational excellence.
- Lead or support cost-reduction projects related to power-module products.
- Coach and develop engineering team members while ensuring projects are delivered according to quality, cost, and timeline expectations.
Qualifications and Experience
- Bachelor's degree or higher in Electronics, Electrical Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering, Industrial Engineering, or a related field.
- At least eight years of relevant experience in semiconductor assembly, power modules, wafer-level packaging, IC packaging, or electronic-module manufacturing.
- Previous experience in a technical leadership, project leadership, supervisory, or engineering-management capacity.
- Strong experience in product or process development, material selection, assembly, and package reliability.
- Strong knowledge of engineering data analysis, SPC, DOE, APQP, and FMEA.
- Candidates must have detailed practical knowledge of at least two or three of the following processes:
- Advanced SMT, including high-density, multilayer, or double-sided component assembly.
- Silver or copper sintering, including pressure and pressureless sintering.
- Soft-solder die attach.
- Aluminium or aluminium-copper wedge and ribbon bonding.
- Vacuum or formic-acid reflow.
- Advanced flip-chip processes, including multi-die, stacked-die, fine-pitch flip chip, and thermo-compression bonding.
- Capillary underfill for fine-pitch flip-chip or thermo-compression bonding applications.
- Advanced copper-clip processes, including exposed copper clips.
- Heat-sink or heat-slug attachment.
- Advanced moulding, including double-sided moulding, low-wire-sweep moulding, liquid moulding, and compression moulding.
- Low-stress blade or laser-singulation processes.
Key Competencies
- Strong technical leadership and cross-functional coordination skills.
- Excellent analytical, decision-making, and problem-solving abilities.
- High level of responsibility and attention to detail.
- Quality-focused mindset with a strong commitment to zero-defect manufacturing.
- Ability to communicate effectively with technical teams, management, and customers.
- Good command of English.
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