Job Details: Job Description: Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical semiconductor assemblies. This role involves working in close collaboration with packaging assembly module teams,
Summary: This role is responsible for driving the thermal design and optimization of high‑performance computing (HPC) systems using advanced Multiphysics simulations and CAD‑based design support. The role focuses on thermal and CFD modeling to evaluate new
Job Details: Job Description: Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intels next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor
Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel’s future assembly packaging platform technologies. Optimizes manufacturing
Job Details: Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intels roadmap of future assembly packaging platform
Job Details: Job Description: About the Role Join Intel’s Advanced Packaging Technology and Manufacturing team and help shape the future of semiconductor packaging. In this role, you will develop and optimize cutting-edge equipment and processes that
Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology
Job Details: Job Description: The Role and Impact As a Yield Development Engineer, you will play a vital role in Intels process development lifecycle, directly influencing product quality and driving technological innovation. Your contributions will shape the next generation
Job Details: Job Description: The Module Engineer On Shift (MEOS) provides real-time factory support by addressing equipment, process, and product issues to ensure continuous 24/7 manufacturing operations. This role is responsible for supporting lot movement through the
Software Engineer Job Responsibilities:Develops information systems by designing, developing, and installing software solutions. Software Engineer Job Duties: Determines operational feasibility by evaluating analysis, problem definition, requirements, solution development, and proposed solutions. Documents and demonstrates solutions by developing documentation, flowcharts,
Job Description: At Bank of America, we are guided by a common purpose to help make financial lives better through the power of every connection. We do this by driving Responsible Growth and delivering for our
Job Description: At Bank of America, we are guided by a common purpose to help make financial lives better through the power of every connection. We do this by driving Responsible Growth and delivering for our
Job Title: Mechanical Assembly Production Engineer Department: Manufacturing Engineering Reports To: Manufacturing Engineering Manager Position Summary We are seeking a highly motivated Mechanical Assembly Production Engineer to support precision mechanical builds within a semiconductor cleanroom manufacturing environment. This
JOB TITLE: Process Engineer II DEPARTMENT: Engineering REPORTS TO: Engineering NPI Manager/CTO SUMMARY: Under the direction of the site Senior Process Engineer and NPI (New Product Introduction) Program Manager, the Process Engineer manages new products that enters the facility
Job Details: Job Description: We are seeking an experienced Sr Engineer to lead the full lifecycle of test development, test engineering, and solution deployment for a Foundry Test Organization. In this role you will assess operational, economic, and
Job Details: Job Description: As a Physical Design Timing Engineer, you will play a pivotal role in shaping the performance, power efficiency, and functionality of Intels cutting-edge System-on-Chip (SoC) designs. Your expertise will directly impact product quality,
Job Details: Job Description: Intels Sort Test Technology Development (STTD) team is looking for a versatile Software & Infrastructure Engineer to architect, build, and maintain cloud-native applications and distributed systems that power semiconductor manufacturing and testing operations. This
Job Description: Join a develop and support team for the Advantest V93000 Semiconductor Test System with a focus on Analog, Power Management and Automotive device applications. Provide application technical leadership and support in the pre and
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Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more