Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops media and collaterals for assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intels roadmap
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Preferred candidate shall demonstrate experience with: • Developing complete industrial test plans for high performance mixed-signal integrated circuits on industry standard Automated Test Equipment (ATE) • Designing custom circuitry on ATE interface boards for testing high-precision,
Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology
Job Details: Job Description: Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intels next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor
Job Details: Job Description: Intel is seeking a Substrate Packaging Research and Development Engineer to join our Packaging Technology Development organization. In this role, you will develop innovative assembly processes and equipment solutions that enable Intel’s future packaging technology
Job Details: Job Description: The Advance Packaging Technology Development APTD SWA is at the center of making Intel Foundrys and APTMs advanced package substrate roadmap a reality. We do this by collaborating with our internal Integration team
Job Details: Job Description: The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique opportunity
Job Description: At Bank of America, we are guided by a common purpose to help make financial lives better through the power of every connection. We do this by driving Responsible Growth and delivering for our
Job Description: Join Pape-Dawson’s Murfreesboro team and help shape the future of one of Middle Tennessee’s fastest-growing communities. Formerly RaganSmith, our Tennessee team has roots dating back to 1933, when the firm began as a land
Job DetailsJob Location: Lotus HQ - Chandler, AZ 85226Position Type: F/T RegularSalary Range: $123,200.00 - $143,200.00 SalaryJob Shift: DayThe Chief Engineer is responsible for leading and creating product designs for internally or externally funded research and development programs,
Job Details: Job Description: The Role and Impact As a Packaging Quality and Reliability Engineer, you will play a critical role in Intels mission to deliver world-class semiconductor technologies. In this position, you will drive quality and
Job Details: Job Description: Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of
Quality Engineer (Supplier Quality Focus) Location: Chandler, Arizona Reports To: Director of Quality U.S. Citizenship Requirement: Due to U.S. Government contract requirements applicable to this position, only U.S. citizens are eligible for employment in this role. About
Company Description Renesas Electronics is seeking a skilled and motivated Senior Digital Design Engineer to join our growing hardware development team in Chandler, AZ. In this role, you will be responsible for designing power and area-optimized digital circuits
Summary: VIAVI (NASDAQ: VIAV) is a global provider of network test, monitoring and assurance solutions for telecommunications, cloud, enterprises, first responders, military, aerospace, and railway. VIAVI is also a leader in light management technologies for 3D
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
As a DfT engineer, you will join a highly experienced team. Your key responsibilities will be: 1) Closely collaborate with Product Definer, Analog Design Lead, Digital Design Lead, Test Lead, Product Engineer, Quality Engineer, Validation Engineer – to identify the
Company Description To take technical lead or significant contribution of Analog design of complex power management integrated circuits. You will be expected to support analog team members with guidance in Analog best practice, drive identification and
Company Description Job Description As a mixed signal verification engineer, you will be responsible for the verification and modeling of mixed-signal power chips, such as PMICs and battery chargers. You will work closely with cross-functional teams, including