Description Focus: Technical leadership, cross-functional alignment, packaging strategy & improvement Leads complex packaging projects across multiple product families or value streams Develops & validates packaging solutions considering manufacturability, sustainability, cost, logistics, and regulatory requirements Leads packaging testing protocols and establishes
Autumn Harp in Essex Junction, VT, is seeking a full-time Packaging Engineer to join the New Product Development team on-site. You will manage packaging development from concept to launch, including testing, creating product specifications and trailing, and coordinating line
Company Description Autumn Harp is a specialized research and manufacturing partner in the cosmetics and skincare industry located just outside Burlington, Vermont. The company focuses on cutting-edge technology. From its origins as a small natural remedies
GlobalFoundries in Essex Junction, Vermont is seeking a Senior Engineer with expertise in chiplet-based system integration for advanced heterogeneous solutions. This role requires leading integration strategies for advanced packaging technologies such as 2.5D/3D. The ideal candidate should have
If you are unable to complete this application due to a disability, contact this employer to ask for an accommodation or an alternative application process. Full Time Regular Essex Junction, VT, US 6 days ago Requisition
About GlobalFoundries GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three
GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional teams to support development and manufacturing of electro-optical transceivers using GF’s
GlobalFoundries in Essex Junction, VT is seeking a hands-on Assembly Process Integration Engineer to deliver electro‑optical transceivers using GF’s Photonix platform and 2.5D/3D co‑packaged optics. You will focus on tool‑process interactions for SiPh Flip Chip assembly, concentrating
GlobalFoundries seeks a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional teams to support development and manufacturing of electro-optical transceivers using GF’s Photonix
About GlobalFoundries GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three
About GlobalFoundries GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three
GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D bump process engineer to become part of our Quantum Advanced Packaging team. This role will entail driving next-generation interconnect scaling development efforts in our Advanced Packaging and Photonics Center
GlobalFoundries in Essex Junction, Vermont is seeking a highly skilled R&D assembly engineer for its Quantum Advanced Packaging team. This role will lead the development of cryogenic assembly processes for quantum packaging, ensuring the integration of advanced techniques. The
About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents,
GlobalFoundries seeks a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional engineering teams to support development and manufacturing of electro-optical transceivers using GF’s
Description Focus: SME (Technical & Processes), cross-functional influence & alignment, large-scale project leadership, strategic influence & impact. Serves as SME for production processes, asset management, Lean concepts, and safety compliance & risk management. Independently leads large-scale,
The Mechanical Engineer on the Dynapower Defense team will work collaboratively with their teammates to develop power conversion military products that exceed our customers’ expectations. They will apply their military product development expertise to deliver mechanically sound,
GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D assembly engineer to become part of our Quantum Advanced Packaging team. This role will drive next‑generation assembly scaling development in our Advanced Packaging and Photonics Center (APPC) and with
GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D bump process engineer to become part of our Quantum Advanced Packaging team. This role will entail driving next-generation interconnect scaling development efforts in our Advanced Packaging and Photonics Center
About GlobalFoundries GlobalFoundries is a leading full‑service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents,