pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission—to enhance Murata’s world-class capabilities with high-performance semiconductors. With
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomm’s Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomms current/future chipsets using FEA expertise,
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: The Qualcomm Package Electrical Team has an opening in the areas of signal integrity and power integrity. The candidate will work with package and IC
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications. The qualified individual will develop thermal solutions for
Who We Are: Neurocrine Biosciences is a leading biopharmaceutical company with a simple purpose: to relieve suffering for people with great needs. We are dedicated to discovering, developing and commercializing life-changing treatments for patients with under-addressed
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This individual independently plans, performs the moderately-defined responsibility for new product development risk analysis, characterization, and mitigation of electronic packages working with internal design and
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomm’s Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomms current/future chipsets using FEA expertise,
Date Posted:2026-08-19 Country:United States of America Location:US-CA-SAN DIEGO-SD1 ~ 8650 Balboa Ave ~ SAN ANTONIO BLDG Position Role Type:Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements: The ability to obtain and maintain a U.S. government
Process Development Engineer IV (Staff) San Diego, California, United States Process Development Engineer IV (Staff) Qualifications BS Degree in Mechanical Engineering, Bioengineering, Chemical Engineering, Manufacturing Engineering, or scientific discipline required Minimum 8-12 years related experience, including years of higher-level education
At Elevate Semiconductor, we empower semiconductor and system test customers by creating world class ICs that tackle the industry’s most complex automated test equipment challenges. Our innovative team designs the lowest power, highest density solutions to
Join our fast-paced and passionate team as a Opto-Mechanical Engineer 2. As we scale, you will be instrumental in building our foundation from the ground up. This is a dynamic, hands-on role for a self-starter who thrives
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: Primary focus with New Product Introduction. Candidate will be the Quality Engineering representative and must be active participant within Core development teams to launch
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Machine Learning Engineering General Summary: As part of the AISW engineering team at Qualcomm, you will own the CI, build, and release infrastructure for the Delegates portfolio —
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: Creates test plans, test procedures, manufacturing solutions, HW designs for leading-edge mid-high power ASIC products in the most advanced process technologies. Performs silicon design verification,
Company:Qualcomm Innovation Center, Inc. Job Area:Engineering Group, Engineering Group Software Engineering General Summary: This position is not eligible for Qualcomm immigration sponsorship. Drive Linux innovation for Qualcomm’s next-generation server-class CPUs. Join our Linux Platform team to
Company:Qualcomm Innovation Center, Inc. Job Area:Engineering Group, Engineering Group Software Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help create
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Software Engineering General Summary: The Qualcomm Cloud AI team is looking for a Linux device driver engineer for QCR-100 and related accelerators. These products accelerate image reprocessing and AI
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: This individual leads, plans, synthesizes ambiguous or conflicting requirements and performs the complex responsibility of planning, designing, and developing electronic systems, circuits, components, integrated
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Software Engineering General Summary: Qualcomm’s central baseband hardware systems organization designs and delivers baseband and embedded system reference platforms that emphasize close co‑design of silicon, packaging, and PCB interconnects