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As an Applications Engineer for Advanced Packaging, you will provide pre- and post-sales technical support to customers integrating Wolfspeed SiC substrates into 2.5D and 3D packaging architectures for high-performance computing (HPC) and AI data center applications.
Supervisor (R&D) Location: Hickory, NC, US, 28601 Company: Corning Requisition Number: 75674 The company built on breakthroughs. Join us. Corning is one of the worlds leading innovators in glass, ceramic, and materials science. From the depths
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