Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomms Integrated Circuits (IC) Packaging organization and represents a senior leadership role within the Mechanical Simulation function. The Director will
Overview This position is open until filled with an initial application review to take place on July 27, 2026 The starting salary range for this position is $7,400.00 - $7,900.00 per month depending upon qualifications and
Hours: Shift Start Time:Variable Shift End Time:Variable AWS Hours Requirement:8/40 - 8 Hour Shift Additional Shift Information: Weekend Requirements:As Needed On-Call Required:No Hourly Pay Range (Minimum - Midpoint - Maximum):$68.450 - $88.330 - $98.920 The stated
Date Posted:2026-07-06 Country:United States of America Location:US-CA-SAN DIEGO-15110 ~ 15110 Ave of Science ~ SCIENCE, Ste 200 Position Role Type:Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements: The ability to obtain and maintain a U.S.
Date Posted:2026-07-06 Country:United States of America Location:US-CA-SAN DIEGO-15110 ~ 15110 Ave of Science ~ SCIENCE, Ste 200 Position Role Type:Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements: The ability to obtain and maintain a U.S.
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: Job Overview: Design adaptive power management controller, on-chip sensor controller and digital power meter. Perform RTL design, simulation, synthesis, timing analysis, lint check, clock domain
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group PMIC Design General Summary: Oversees definition, design, verification, and documentation of mixed signal circuits and/or products in the field of Power Management. Determines architecture design and circuit level
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group RFIC Design General Summary: Define, design and develop complex radio frequency integrated circuits in complex SoC’s and discrete RFIC’s. Perform radio signal path and circuit topology analysis and
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomm’s Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomms current/future chipsets using FEA
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: In this position, you will be responsible for RTL design and verification of digital IPs used across the board in Qualcomm chips. You will
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives communication and data processing transformation to
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: Applicants selected will be subject to a government security investigation and must meet eligibility requirements for access to classified information. Must be a U.S.
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: Job Description Next Generation, High-Speed, Memory and Cache Controller and Advanced Memory NoCs based Subsystem Design Team is looking for a Senior ASIC Design
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Cellular Technologies Software General Summary: This individual leads, plans, synthesizes ambiguous or conflicting requirements and performs the complex responsibility of the designing, standardizing, implementing, verifying, validating, and commercializing
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group GPU ASICS Engineering General Summary: This individual independently plans, performs the moderately-defined responsibility for the architecting, designing, implementing, verifying, and optimizing performance and power of GPU cores. Responsible
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Video Systems, HW Architecture General Summary: This individual possesses the solid engineering fundamentals and understanding with some supervision in the research, design, development, and optimization of video codec
Export Control Requirement: Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: We are seeking a senior-level Low Power Chip Architect / System Engineer with deep expertise in mixed-signal IC and system design and a proven
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Video Systems, HW Architecture General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group GPU ASICS Engineering General Summary: Join Qualcomm Technologies Inc GPU Compiler team to develop software solutions for the world class GPU products. Adreno GPU has been the industry