Minimum qualifications: Bachelors degree in Mechanical, Material, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience. 5 years of experience in chip package substrate design using Cadence APD (Allegro Package Designer) or Mentor Expedition
Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In Create Account) 2. If you already have a Candidate Account, please
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Systems Engineering General Summary: Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses
Associate Publicis Media harnesses the power of modern media through leading agency brands Dysrupt, Infinite Roar, Publicis Collective, Publicis Health Media, Spark Foundry, Starcom and Zenith, as well as global accelerator PMX; immersive experience group PMCI
Rocketship Public Schools: Senior Associate of Extending Learning At Rocketship Public Schools, we believe in the infinite possibility of human potential. We believe that every student deserves the right to dream, to discover, and to develop
Teradar is pioneering a new era in perception with the world’s first automotive terahertz vision sensor, delivering ultra-high-resolution imaging in any weather condition. Founded in Boston, Teradar’s solid-state, chip-scale technology unlocks safer, smarter vehicles and opens
HCLTech is looking for a highly talented and self- motivated Substrait Design engineer to join it in advancing the technological world through innovation and creativity. Job Title: Substrait Design engineer Job REQ ID: 117930 Position Type:
Position Overview We are seeking a highly motivated Chiplet Package Design Engineer to drive the development of advanced packaging solutions for next-generation semiconductor products. This role focuses on 2.5D and 3D heterogeneous integration, enabling high-performance computing,
Position Overview We are seeking a highly skilled ADK (Assembly Design Kit) Development Engineer to lead the creation, integration, and validation of design enablement infrastructure for 2.5D/3D advanced packaging, including chiplet-based architectures, silicon interposers, and heterogeneous
Position Overview We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer chiplet-based product development using Rapidus advanced packaging technologies. This role serves as
Company Description Axiado is building the future of AI powered digital infrastructure. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management. Our technology