onsemi is seeking a highly motivated Semiconductor Device Characterization Engineer at Hopewell Junctions, New York. to support high-volume manufacturing and new technology development activities. Expertise in trench MOSFET and/or IGBT is desired. This role serves as a critical
onsemi is seeking a highly motivated engineer to work in our Technology Development group as a Process Integrator on Image Sensor technologies. This will include driving continuous improvement on new processes, new pixel architecture and technologies,
onsemi is seeking a Manufacturing Integration Engineer at our EFK Hopewell Junction site. We are a leading innovator in semiconductor technology, dedicated to advancing power electronics through cutting‑edge research and development. We are seeking a talented and
onsemi is seeking a highly motivated engineer to join our Technology Development group as an Integration Engineer at our Hopewell Junction, NY site. This will include driving continuous improvement on new processes, new product architecture and
onsemi is seeking a Manufacturing Integration Engineer in our EFK Hopewell Junction site. We are a leading innovator in semiconductor technology, dedicated to advancing power electronics through cutting‑edge research and development. We are seeking a talented and
We are seeking a highly motivated and experienced semiconductor Senior Module Engineer to join our growing 300mm Post Fab team in East Fishkill, NY. This role is critical to our ability to improve manufacturing performance and drive
Planning Coordinator PrecisionX Group is a leading provider of precision metal components, serving critical industries such as aerospace & defense, medical devices, satellite & space, electric vehicles, mining, and semiconductors. By uniting the specialized expertise of GEM, Coining,
Director Of Probe & Post-Fab Operations The Director of Probe & Post-Fab Operations is responsible for end-to-end leadership of wafer manufacturing activities from electrical probe through post-fab processing, including wafer thinning and back side metallization. This