Job Details: Job Description: Join Intel and build a better tomorrow. Manufacturing Development Customer Engineering (MDCE) is Intels newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and
Job Details: Job Description: The Advanced Packaging Technology and Manufacturing (APTM) organization is looking for data scientist to support Thermal Compression Bonding (TCB) process control, manufacturing data analytics, yield improvement, and predictive modeling. The successful candidate
Job Details: Job Description: The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a
Job Details: Job Description: The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal Compression Bonding (TCB) technologies. The successful
Company Description At Renesas, we are more than just a semiconductor company; we are the engine behind a safer, smarter, and more sustainable future. Headquartered locally in the heart of San Jose, our Silicon Valley team