Wafer Bond Process Engineer Description - HP is seeking a highly motivated Process Engineer to provide technical leadership for wafer bonding technologies supporting both high-volume manufacturing and next-generation MEMS product development. This role is responsible for sustaining and improving
POSITION SUMMARY The Design & Product Engineer (Mechanical) is responsible for the mechanical architecture, design and integration of products, tools, testers and components. This position knows and applies the fundamental concepts, practices and procedures to design mechanical
NOTE: THIS POSITION IS ELIGIBLE FOR REMOTE WORK IF RESIDING MORE THEN 30 MILES FROM A PHYSICAL NUSCALE OFFICE. WORK MUST BE PERFORMED WITHIN THE CONTIGUOUS UNITED STATES WITH TRAVEL AS REQUIRED FOR BUSINESS NEEDS. POSITION
Controls System Engineer Description - The Controls Engineering group is responsible for providing solutions that enable automation and systems capability across HPās portfolio of manufacturing across the Corvallis, OR site. While onsite scale of application is typically R&D
Tooling Repair and Maintenance Technician Description - Primary functions of this role are the day-to-day operations, maintenance, and support of tooling and equipment used on an Inkjet Manufacturing Final Assembly Line. Responsibilities include the repair and
About the Organization E2 Consulting Engineers, LP (E2) is a professional services firm established in 1988 specializing in a full spectrum of engineering services including, project engineering and design, federal base operations and infrastructure support services, gas
MTS - Tooling, Vision and Controls Manager Description - The MTS VISTA Measurement Automation Controls Systems (VMACS) team has the mission to enable the growth of HP by delivering robust, cost-efficient, end-to-end measurement and smart manufacturing