Overview Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsofts over
Join our fast-paced and passionate team as a Photonics Engineer 3 Components dedicated to the design, development, and evaluation of sophisticated photonic components utilized in high-performance optical systems. As we scale, you will be instrumental in building our manufacturing
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: The Qualcomm Data Center AI Hardware Engineering team designs and develops motherboards/add in cards/modules for Qualcomm new AI System On Chip (SoC)/System In Package (SIP).
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Analog Mixed Signal Design General Summary: QCT Mixed-Signal IP (MSIP) design team is looking for talented analog integrated circuit designers at various levels to help with designing high-performance and low-power
L3Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers’ mission and quest for professional growth. L3Harris provides an
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Video Systems, HW Architecture General Summary: The Machine Learning Hardware Accelerator team is seeking an experienced and talented Hardware Design & Architecture Lead. This role will drive the definition
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives communication and data processing transformation to
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives communication and data processing transformation to
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives communication and data processing transformation to
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives communication and data processing transformation to
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: About Qualcomm: Qualcomm is a global leader in wireless technology, driving innovation and shaping the future of connectivity. We are looking for talented and
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: Job Overview: Design adaptive power management controller, on-chip sensor controller and digital power meter. Perform RTL design, simulation, synthesis, timing analysis, lint check, clock domain crossing
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group RFIC Design General Summary: Define, design and develop complex radio frequency integrated circuits in complex SoC’s and discrete RFIC’s. Perform radio signal path and circuit topology analysis and detailed transistor-level
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group DSP Architecture and Design General Summary: A variety of high performance, low power Hexagon/NPU cores are at the heart of Qualcomms multi-tier mobile SOC, Server, IoT, Automotive roadmap. The
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group DSP Architecture and Design General Summary: A variety of high performance, low power Hexagon cores are at the heart of Qualcomm’s multi-tier mobile SOC, IoT, Automotive roadmap. The Hexagon
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Analog Mixed Signal Design General Summary: Oversees definition, design, verification, and documentation for development of a variety of CMOS mixed analog/digital blocks such as: data converters, PLLs, analog/digital filters, low
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group CPU Engineering General Summary: Drive the Silicon That Powers the Next Generation of Computing We’re looking for a CPU Physical Design expert to push the limits of performance, power
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Modem Technologies General Summary: Qualcomm is the world’s largest fabless semiconductor company and a global leader in wireless innovation—powering the majority of 3G, 4G, and 5G devices while
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: QCT mixed-signal IP design team is looking for skilled system architect to help design high-speed, high-performance, and low-power DDR Phys for Qualcomm’s products targeted for 5G,
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group DSP Architecture and Design General Summary: A variety of high performance, low power Hexagon/NPU cores are at the heart of Qualcomm’s multi-tier mobile SOC, Server IoT, Automotive roadmap. The