Principal Substrate and Packaging Engineer Fully onsite in the San Francisco Bay Area Full time opportunity $400-500K total compensation package- base, bonus, stock (depends on skillset/experience level) Industry leader in semiconductor design focused on advanced IC
About the Role: As the Hardware Lead, you will serve as the technical cornerstone driving the architecture and implementation of Reconceive’s next-generation analog MAC IP and custom memory. At Reconceive, we believe the future of AI
Research Scientist – Formal Methods One of the worlds most exciting startups; a well-funded AI Lab building the next generation of AI tools for chip design are hiring for Formal Methods Researchers. Backed by an advisory
Senior Technical Lead- TIA Design Full Time Opportunity Ideally on sight in the bay area (open to be flexible for the right candidate) 450K+ first year total compensation package (higher compensation packages depend on skillset/experience, open