Minimum qualifications: Bachelors degree or equivalent practical experience. 10 years of experience in program or project management. 10 years of experience in program or project management in a mission-critical facilities (e.g., data centers, chip fab), design-build,
Job Details: Job Description: As a Physical Design Timing Engineer, you will play a pivotal role in shaping the performance, power efficiency, and functionality of Intels cutting-edge System-on-Chip (SoC) designs. Your expertise will directly impact product quality,
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than
Minimum qualifications: Bachelors degree in a technical field or equivalent practical experience. 8 years of experience in data center operations or other relevant operational experience in non- data center industries (e.g., power generation, HVAC and refrigeration,
Minimum qualifications: Associates degree, trade school certification, or other certified training in a related technical field, or equivalent practical experience. 5 years of mechanical/HVAC experience in an industrial or commercial environment. Ability to participate in material
Minimum qualifications: Associates degree, trade school certification, or other certified training in a related technical field, or equivalent practical experience. 5 years of electrical experience (e.g., electrical testing equipment or electrical distribution) in an industrial or
Minimum qualifications: Experience with performing component-level repairs and troubleshooting on technical equipment. Experience diagnosing and troubleshooting one of the following: operating systems, computer/server hardware, or networking protocols. Ability to lift/move 50lb (23kg) of equipment and ability
Minimum qualifications: Experience with performing component-level repairs and troubleshooting on technical equipment. Experience diagnosing and troubleshooting one of the following: operating systems, computer/server hardware, or networking protocols. Ability to lift/move 50lb (23kg) of equipment and ability
Minimum qualifications: Experience with performing component-level repairs and troubleshooting on technical equipment. Experience diagnosing and troubleshooting one of the following: operating systems, computer/server hardware, or networking protocols. Ability to lift/move 50lb (23kg) of equipment and ability
Job Details: Job Description: Join Intel as a System Software Engineer, where you will play a pivotal role in designing, developing, and optimizing software solutions across Intels cutting-edge technology portfolio. In this critical position, you will contribute
Job Details: Job Description: Intel Corporation is a global technology leader and one of the worlds largest and most innovative semiconductor companies. For more than five decades, Intel has been at the forefront of designing and
Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development
Job Details: Job Description: Intel is a global leader in semiconductor technology, driving innovation that powers the worlds most advanced computing devices. Intel Foundry Construction and Sourcing (FCS) builds the worlds largest semiconductor manufacturing facilities across the
Requisition ID: 296524 Relocation Authorized: National - Family Telework Type: Full-Time Office/Project Work Location: Chandler, AZ Extraordinary teams building inspiring projects: Since 1898, we have helped customers complete more than 25,000 projects in 160 countries on
Location: Hybrid in Chandler Az Job Description The Lead IoT Engineer is responsible for the architecture, implementation, security, and operation of enterprise-scale Internet of Things (IoT) and edge computing platforms. This role leads the design of connected systems
Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development