Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the
Description We are seeking an experienced Senior Technical Program Manager (TPM) with strong NAND/SSD expertise to lead complex hardware programs across the full product lifecycle. This role will drive cross-functional execution for SSD/NAND qualification, integration, sustaining engineering, supplier engagement,
Context Works either in Customer Support or in BL Apps (AE, Brion or HMI) and can be located in the field as well as at HQ working on sustaining, NPI or customer projects. Interfaces with program and
Job Details: Job Description: Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical semiconductor assemblies. This role involves working in close collaboration with packaging assembly module
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers
Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of
Job Details: Job Description: Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intels next-generation assembly and packaging platform technologies. This role is integral to driving innovation in
Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel’s future assembly packaging platform technologies. Optimizes manufacturing processes
Job Details: Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intels roadmap of future assembly packaging platform
PacSci EMC, a Ralliant operating company, is seeking a Senior Program Manager to lead complex aerospace and defense programs supporting major customers and mission-critical applications. This role serves as the primary customer-facing leader for assigned programs and is responsible
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers
Together, we own our company, our future, and our shared success. As an employee-owned company, our people are Black & Veatch. We put them at the center of everything we do and empower them to grow,
Algonquin Power & Utilities Corp. (AQN), parent company of Liberty, is a diversified international generation, transmission, and distribution utility. AQN is committed to providing safe, reliable, and cost-effective energy and water solutions through our portfolio of
Algonquin Power & Utilities Corp. (AQN), parent company of Liberty, is a diversified international generation, transmission, and distribution utility. AQN is committed to providing safe, reliable, and cost-effective energy and water solutions through our portfolio of
Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology
Job Details: Job Description: The Role and Impact As a Yield Development Engineer, you will play a vital role in Intels process development lifecycle, directly influencing product quality and driving technological innovation. Your contributions will shape the next
Job Details: Job Description: The Module Engineer On Shift (MEOS) provides real-time factory support by addressing equipment, process, and product issues to ensure continuous 24/7 manufacturing operations. This role is responsible for supporting lot movement through
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into
Job Details: Job Description: The Hard IP and Test Chip Development team, within Intels Central Engineering Group, is responsible for delivering industrydefining analog and mixedsignal IP for Intels Client, Datacenter, AI and Foundry customers. The IO team owns
Technical Program Manager (TPM) About Us We’re on a mission to turn ambitious ideas into impactful realities . Our teams design and deliver technology solutions that solve real-world problems—whether that’s building platforms that connect communities, streamlining operations