Director of Engineering, General Purpose and Node Platform In accordance with Washington state law, we are highlighting our comprehensive benefits package, which is available to all eligible US based employees. Benefits for this role include: Health, dental,
Company Description Join us and make YOUR mark on the World! Lawrence Livermore National Laboratory (LLNL) has turned bold ideas into world-changing impact advancing science and technology to strengthen U.S. security and promote global stability. Our mission
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform
Minimum qualifications: Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience. 8 years of technical experience in physical design disciplines involving power delivery and advanced process technology nodes. Experience
Headquartered in Silicon Valley, we are a newly established start-up, where a collective of visionary scientists, engineers, and entrepreneurs are dedicated to transforming the landscape of biology and medicine through the power of Generative AI. Our
Overview Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose, CA. In this
Minimum qualifications: Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience. 10 years of experience in physical design, including custom structured datapath implementation. Experience hardening dense compute units
AWS Utility Computing (UC) provides product innovations — from foundational services such as Amazon’s Simple Storage Service (S3) and Amazon Elastic Compute Cloud (EC2), to consistently released new product innovations that continue to set AWS’s services
The application window is expected to close on: 09/01/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received. Meet the team: The Common Hardware Group
Job Details: Job Description: Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview: Manufacturing Development Customer Engineering (MDCE) is Intels newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between
Company OverviewKLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device
Minimum qualifications: Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience. 8 years of experience in post-layout physical netlist validation or low-power signoff in an ASIC design environment.
Minimum qualifications: Bachelors degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience. 12 years of experience in Physical Design, Custom Digital Circuit Design, or Custom Layout. Experience delivering GDS for advanced
Job Details: Job Description: Intel is transforming from an Integrated Device Manufacturer (IDM) to a leading foundry service provider, offering world-class manufacturing capabilities to customers worldwide. Our Manufacturing Development and Customer Engineering (MDCE) organization is at
Minimum qualifications: Bachelors degree or equivalent practical experience. 8 years of experience programming in C++. 5 years of experience testing, and launching software products. 5 years of experience building and developing large-scale infrastructure, distributed systems or
At Cornelis we’re building the future of AI and HPC networking with an AI-first approach to silicon and software development. We’re seeking engineers who are energized by working on cutting-edge ASIC design and distributed software systems,
SASE Cloud Software Engineer - AI & Backend This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office. Who We Are: Hewlett Packard Enterprise is the global edge-to-cloud
Fortinet is expanding its Financial Planning & Analysis (FP&A) function, a strategic pillar designed to accelerate sales visibility and provide a competitive financial advantage. We are seeking a Senior Manager to join our established team of
Position:Physical Design Engineer II (eInfochips Inc) Job Description: What Youll Be Doing: Execute synthesis, PNR, and STA for assigned partitions of ASIC chip adhering to strict schedules and design goals. Work closely with architects, RTL designers,
Company OverviewKLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device