SummaryDo you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here!
SummaryDo you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish
SummaryDo you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision,
Overview: Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 2,000+ employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product introductions
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomm’s Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomms current/future chipsets using FEA expertise,
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomms Integrated Circuits (IC) Packaging organization and represents a senior leadership role within the Mechanical Simulation function. The Director will lead a
Blue Origin’s Silicon Systems team seeks a Senior IC Packaging: Signal and Power Integrity Engineer to own SI/PI for RFIC and mmWave packaging. You’ll perform SI analysis and HFSS simulations, design power delivery networks, and collaborate with RFIC, mmWave,
Ciena Corporation in New Jersey is seeking an Optoelectronic IC Package Design Director to lead custom in-house photonic, analog, and digital IC packaging for next-generation optical modules. You will drive advanced package selection, manage schedules, oversee layout, SI/PI optimization,
Entrada Ventures is seeking a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for high-performance AI accelerators, focusing on package architecture, substrate design, manufacturability, and vendor engagement. You will define substrate stackups, bump and ball
Delos Data Inc, located in Palo Alto, California, is seeking a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for high-performance AI accelerators. This role involves collaborating with IC design teams and managing vendor relationships to
Intel Corporation is seeking a Module Engineer in Albuquerque to own and optimize high-volume manufacturing equipment for next-generation advanced packaging like FOVEROS-S and EMIB. You will lead technology transfers, drive improvements in safety, quality, yield, and costs,
About TylSemi, Inc. The Opportunity The AI infrastructure market is exploding. Every hyperscaler, every cloud provider, every AI company is building custom silicon. But they all face the same problem: how do you connect hundreds of
SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this
The application window is expected to close on: 09/30/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received. Meet the Team The Common Hardware Group
Overview SRI’s Integrated Systems & Solutions (InSyS) Division designs leading-edge R&D technologies that power the systems end users depend on every day. From proof-of-concept to execution in the real world, we provide our customers the keys
MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge
Department: Advanced Power Systems (APS). This role emphasizes Advanced Power Management System IC Architecture for Point of Load (PoL) solutions. Role Overview We are seeking a visionary System IC Architect with deep expertise in system-level architecture, high-performance power
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: The Qualcomm Package Electrical Team has an opening in the areas of signal integrity and power integrity. The candidate will work with package and IC designers
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into