Job Details: Job Description: The Role and Impact: Join Intels Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting innovative solutions for next-generation technology development in wafer processing, assembly/test, and
Job Details: Job Description: Manufacturing Development and Customer Engineering (MDCE) is a strategic organization within Intel Foundry Technology Manufacturing focused on improving process capability across Intels technology portfolio-from initial product qualification through high-volume manufacturing. MDCEs mission is
Job Details: Job Description: The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal Compression Bonding (TCB) technologies. The successful
Job Details: Job Description: Microelectronic Packaging Collateral Engineers provide project management, equipment collateral design/development, and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components, and/or completed units. Responsibilities include but are not limited to
Job Details: Job Description: Module Packaging Media Engineers provide project management, media design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. The responsibilities include but are not limited to the
Job Details: Job Description: Join Intel - and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives
Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences
Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences
Job Details: Job Description: Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role
Job Details: Job Description: This position is in the Intel Mask Operations within the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. In this position the engineer will
Job Details: Job Description: Join Intels Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role you will develop and optimize cutting-edge substrate processes and equipment to enable Intels future packaging platform technologies. Your
Job Details: Job Description: As a Module Development Engineer, you will drive technology development and process enablement for both high-volume manufacturing and next-generation semiconductor technologies. You will be responsible for developing, integrating, optimizing, and sustaining advanced manufacturing processes that
Job Details: Job Description: The Role and Impact As a Packaging Module Development Engineer, you will play a pivotal role in advancing Intels assembly and packaging technologies. You will develop and optimize processes, equipment, and materials to enable
Job Details: Job Description: As a Module Development Engineer, you will be integral to advancing Intels manufacturing processes and semiconductor technology. You will lead efforts in the development and optimization of cutting-edge defect inspection tools and advanced manufacturing solutions.
Job Details: Job Description: Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intels roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing
Job Details: Job Description: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the
Intel Module Development Engineering Manager Join Intels Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting innovative solutions for next-generation technology development in wafer processing, assembly/test, and module repair factories. As a key
onsemi is seeking a Technology Development Manager or Senior Manager in Hopewell Junction, NY, to lead the development and high-volume manufacturing of Embedded Power Module technologies. The role includes managing a team of engineers, executing technology development programs, and engaging
New Product Engineering Technical Leader We are seeking a New Product Engineering Technical Leader (Member of Technical Staff or Sr. MTS) to serve as the Engineering Product Owner (EPO) for SiC / Si Power Discrete and/or
Job Description AutoStore holds a simple yet powerful vision: to store and move things for everyone, everywhere. Founded in Norway, weve grown into a global technology company. AutoStore uses advanced software to automate and orchestrate order