The Mechanical Design Engineer collaborates with a local team or global engineering team on product design which satisfy customer specifications. This process includes design, product validation, completing documentation and executing launch items for production. Complete all
The Position Metalenz is seeking a Fabrication and Process Engineer to prototyping activities for our metasurface-based optical components and devices. This position is a hands-on role in the wafer fab, building devices for internal and external
At WHOOP, were on a mission to unlock human performance and healthspan. WHOOP empowers members to perform at a higher level through a deeper understanding of their bodies and daily lives. As a Mechanical Engineer II
Job Description Are you ready to build the next generation of Play? Join the Creative Play Lab and invent radical new play opportunities and never-seen-before creative experiences for LEGO® fans of today and tomorrow! As a
Senior Cost Accountant Be it by land, air, or sea, Remtecs microelectronic solutions are helping to empower and protect our military services and our country. In the industrial sector, Remtec is meeting and surpassing the high-power and
Vice President, Head of Research and Platform Development Cambridge, MA USA Flagship Labs 110 Inc. (FL110) is a privately held, early-stage technology company developing a fully integrated, end-to-end platform to enable next generation proteomics. Our platform
Vice President, Sales Operations About the Company Globally acclaimed provider of critical products & materials for high-technology manufacturing Industry Semiconductors Type Non Profit Founded 1966 Employees 5001-10,000 Categories Metals Manufacturing Industrials & Manufacturing Chemicals Chemical Products
Microfabrication Engineering Co-Op The Microelectronics Laboratory is seeking students eager to apply their science and engineering skills in the US Government’s most capable wafer fabrication facility. Successful candidates will create and improve wafer fabrication processes
MIT Lincoln Laboratory’s Microelectronics Laboratory is a 200mm wafer facility with commercial-class equipment serving national security and economic interests. The facility processes full-flows for a range of integrated circuit technologies including 90 nm fully depleted silicon-on-insulator
Microfabrication Industrial Engineering Co-Op The Microelectronics Laboratory is seeking students eager to apply their engineering knowledge and skills together with analysis and design principles to improve operational efficiencies within the US Government’s most capable wafer
HyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across AI/datacom infrastructure, hyperscale computing, quantum computing, sensing,
The Advanced Materials and Microsystems Group (G81) aims to leverage physical properties at the small scale to develop enabling novel materials, custom microelectronics, and multifunctional microsystems. Our activities range from developing new approaches to materials discovery,
The mission of the Advanced Materials and Microsystems Group in the Advanced Technology Division is to research and develop a broad array of electronic, electro-optic, and RF materials and devices to develop leap-ahead capability in
MIT Lincoln Laboratory’s Microelectronics Laboratory is a 200mm wafer facility with commercial-class equipment serving national security and economic interests. The facility processes full-flows for a range of integrated circuit technologies including 90 nm fully depleted silicon-on-insulator
Flexcompute is a cutting-edge technology startup that specializes in ultra-fast simulation technology. Our products are utilized by companies in designing and optimizing technology products, with applications ranging from designing airplanes and cars to wind turbines and
The RF and Integrated Photonics Group (Group 85) is committed to advancing technologies in the national interest by harnessing novel RF and photonic capabilities. The group’s work encompasses everything from foundational research into materials and