Title:Package Engineer – Chemicals, Biofuels & Discrete Manufacturing KBR Sustainable Technology Solutions (STS) provides holistic and value-added solutions across the entire asset life cycle. These include world-class licensed process technologies, differentiated advisory services, deep technical domain expertise, energy
Join us in pioneering breakthroughs in healthcare. For everyone. Everywhere. Sustainably. Our inspiring and caring environment forms a global community that celebrates diversity and individuality. We encourage you to step beyond your comfort zone, offering resources
Job Summary An Associate Packaging Engineer works toward development and commercialization of new, improved, and cost-reduced packaging. This position primarily supports base business technical projects and will also assist senior level engineers and packaging teams in complex technical
Overview Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose, CA. In this role, you will
The application window is expected to close on: 07/16/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received. This role can be performed onsite in
K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by $450M from leading investors including Altimeter Capital, Redpoint Ventures, T. Rowe Price, Lightspeed Venture
K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by $450M from leading investors including Altimeter Capital, Redpoint Ventures, T. Rowe Price, Lightspeed Venture
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and
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Minimum qualifications: Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience. 10 years of experience with SI/PI design for chip/package or system PCB. Experience in industry Signal integrity and
We made history and now we work to transform the future – for our customers, our communities and our families. Youll see your work on the road every day, helping people move freely and pursue their
Job Details: Job Description: This role will support root cause determination of assembled package yield loss and in-line failures on a back of week compressed shift. The engineer on shift will be responsible for technical functions such as
SummaryOur Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple’s internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We’re looking for a Package Design Engineer to drive the
SummaryJoin the team behind the technology in a billion pockets worldwide. Apples Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. In this role, youll contribute to the advanced packaging technologies
You’re sooo Benefit! The Associate Package Development Engineer will primarily focus on developing packaging components for promotional, holiday/seasonal and sampling projects. Such projects are packaging one or more finished good items in a special/custom packaging design made from
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented
Minimum qualifications: Bachelors degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience. 8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition. Experience in
Job Details: Job Description: About Altera At Altera, our independence as the world’s largest pure‑play FPGA solutions provider gives us the focus, speed, and agility to innovate without compromise. With more than four decades of industry‑leading
Company Description Renesas is a global semiconductor company delivering embedded solutions across microcontrollers, analog, power, and SoC products. Our technologies support critical applications across automotive, industrial, infrastructure, and IoT markets, helping enable smarter, safer, and more
Waymo is an autonomous driving technology company with the mission to be the worlds most trusted driver. Since its start as the Google Self-Driving Car Project in 2009, Waymo has focused on building the Waymo Driver—The