Anduril Industries is a defense technology company with a mission to transform U.S. and allied military capabilities with advanced technology. By bringing the expertise, technology, and business model of the 21st century’s most innovative companies to
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: Come join us and create what has yet to be imagined. Qualcomm invents foundational technologies that transform how the world connects, computes, and communicates. We
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: We are seeking a highly motivated Staff Packaging Engineer with the capability to lead advanced integrated circuit (IC) packaging development and manage the introduction of new product technologies.
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: The IC Package Engineering (PKGE) team is responsible for developing and deploying advanced packaging technologies to meet increasingly demanding performance, reliability, and system integration requirements. This
ACTIVE TS/SCI w/CI POLY SECURITY CLEARANCE REQUIRED Build it. Deploy it. Own it — at enterprise scale. At D2 Tech Services, Software Packaging Engineers don’t just push packages — they design, build, and sustain the Windows desktop infrastructure
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: Come join us and create what has yet to be imagined. Qualcomm invents foundational technologies that transform how the world connects, computes, and communicates. We
Department:106800 Technical Operations Location:San Diego, USA- Remote Be a part of a global team that is inspired to make a difference in the lives of people living with rare disease. At Travere Therapeutics, we recognize that
Everforth ECS is seeking a Senior Build/Packaging Engineer to work in the National Capital Region covering the Pentagon, Falls Church, and Fairfax. Please Note: This position is contingent upon contract award. The War Data Platform (WDP) is a
Number of Positions: 2 Duration: 4 months Date: Sept 2026 - Dec 2026 Location: Onsite in Sunnyvale, CA, or New York, NY Education Recommendations Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or
Number of Positions: 1 Date: Sept 2026 - Dec 2026 Duration: 4 months Location: Onsite in Sunnyvale, CA or New York, NY EDUCATIONAL RECOMMENDATIONS Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar
PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant
Packaging Engineer The Company If you are looking for a life-changing career opportunity, weve got your prescription. Rodan + Fields® Dermatologists is a direct selling skincare company founded in 2000 by Dr. Katie Rodan and Dr. Kathy Fields,
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications. The qualified individual will develop thermal solutions for
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About Gusto At Gusto, were on a mission to grow the small business economy. We handle the hard stuff — payroll, health insurance, 401(k)s, and HR — so owners can focus on their craft and their
Minimum qualifications: Bachelors degree in Packaging Engineering, Mechanical Engineering, Industrial Engineering, a related engineering field, or equivalent practical experience. 8 years of experience in hardware product packaging and structural design. Preferred qualifications: 8 years of experience in hardware
Subject Matter Expert Electronics Design and Analysis Engineer (Electronic Packaging Design) Company:The Boeing Company Boeing Space, Intelligence & Weapons Systems is currently hiring a Subject Matter Expert Level Space Electronics Packaging and Mechanical Product Design and Analysis Engineer to join