Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomm’s Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomms current/future chipsets using FEA
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: We are seeking a highly motivated Staff Packaging Engineer with the capability to lead advanced integrated circuit (IC) packaging development and manage the introduction of new product technologies.
pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission—to enhance Murata’s world-class capabilities with high-performance semiconductors. With
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications. The qualified individual will develop thermal solutions for
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: The Qualcomm Package Electrical Team has an opening in the areas of signal integrity and power integrity. The candidate will work with package and IC
Date Posted:2026-07-06 Country:United States of America Location:US-CA-SAN DIEGO-15110 ~ 15110 Ave of Science ~ SCIENCE, Ste 200 Position Role Type:Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements: The ability to obtain and maintain a U.S.
Date Posted:2026-07-06 Country:United States of America Location:US-CA-SAN DIEGO-15110 ~ 15110 Ave of Science ~ SCIENCE, Ste 200 Position Role Type:Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements: The ability to obtain and maintain a U.S.
Date Posted:2026-07-06 Country:United States of America Location:US-CA-SAN DIEGO-15110 ~ 15110 Ave of Science ~ SCIENCE, Ste 200 Position Role Type:Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements: The ability to obtain and maintain a U.S.
Date Posted:2026-07-06 Country:United States of America Location:US-CA-SAN DIEGO-15110 ~ 15110 Ave of Science ~ SCIENCE, Ste 200 Position Role Type:Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements: The ability to obtain and maintain a U.S.
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: This individual independently plans and performs moderately-defined responsibilities related to the design and validation of electronic systems, circuits, components, integrated circuitry, equipment, and packaging. Conducts
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: We are seeking a senior-level Low Power Chip Architect / System Engineer with deep expertise in mixed-signal IC and system design and a proven record
Company:Qualcomm Innovation Center, Inc. Job Area:Engineering Group, Engineering Group Software Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of whats possible to enable next-generation experiences and drives digital transformation to help create
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Software Engineering General Summary: The Qualcomm Cloud AI team is looking for a Linux device driver engineer for QCR-100 and related accelerators. These products accelerate image reprocessing and AI
Company:Qualcomm Innovation Center, Inc. Job Area:Engineering Group, Engineering Group Software Engineering General Summary: This position is not eligible for Qualcomm immigration sponsorship. Drive Linux innovation for Qualcomm’s next-generation server-class CPUs. Join our Linux Platform team to
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Software Engineering General Summary: Qualcomm’s central baseband hardware systems organization designs and delivers baseband and embedded system reference platforms that emphasize close co‑design of silicon, packaging, and PCB interconnects
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: Product and Test Engineering (PTE) is looking for a Digital Test Engineers who will create test solutions in support of New Product Introduction (Silicon Validation
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: Qualcomm Overview: Qualcomm is a company of inventors that unlocked edge AI and connected computing ushering in an age of rapid acceleration in connectivity
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: Creates test plans, test procedures, manufacturing solutions, HW designs for leading-edge mid-high power ASIC products in the most advanced process technologies. Performs silicon design
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: San Diego - US Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new
Job ID: 114788 DRS Daylight Solutions business provides industry-changing mid-infrared laser light technology for government and commercial markets, including: defense and security; life sciences; and industrial process control. As a mid-IR technology pioneer, Daylight Solutions has