SummaryPackaging EPM is responsible for the development and orchestration of the unboxing experience, managing development activities, executing builds, and coordinating testing. This role provides an opportunity to work with a world-class team to deliver high-quality, first-class
SummaryWhen was the last time you enjoyed a box as much as the product inside? At Apple, every customer interaction is an opportunity for surprise and delight! This philosophy extends beyond the product to its packaging, where
General Information Job Title Executive Director of R&D Engineering for 3DIC-Advance Packaging Job ID 17450 City Sunnyvale State/Province California Date Posted 11-May-2026 Job Category Engineering Job Subcategory R&D Engineering Hire Type Employee Remote Eligible No Base Salary Range: $268000 -
Senior Packaging Engineering Program Manager The Devices & Services Experience Design (DxD) team leads user experience and industrial design innovation across Amazons device portfolio, including Echo, Fire TV, Fire Tablets, Alexa.com, and related mobile apps. Our team works
Engineering Program Manager, Packaging Packaging EPM is responsible for the development and orchestration of the unboxing experience, managing development activities, executing builds, and coordinating testing. This role provides an opportunity to work with a world-class team to deliver high-quality,
About Lyte Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform
The application window is expected to close on: 08/08/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received. This position is onsite in San Jose,
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into
Primary Duties & Responsibilities Design and develop multi-fiber module packaging for fiber optic devices and modules to create the physical structures, including enclosure, fiber mounting, connection, and sealing. Conduct packaging design simulations and analyses to meet operating conditions,
The application window is expected to close on: 07/31/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received. This position will be on-site in San
SummaryImagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and theres no telling what you
The application window is expected to close on: 08/07/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received. Hardware Engineering Technical Leader (hybrid) - 2014270 *This
General Information Job Title R&D Engineering, Director Job ID 17626 City Sunnyvale State/Province California Date Posted 23-May-2026 Job Category Engineering Job Subcategory R&D Engineering Hire Type Employee Remote Eligible No Base Salary Range: $230000 - $344000 Descriptions & Requirements
Company Overview Why Choose Us? Novolex is a leading manufacturer of food, beverage, and specialty packaging that supports multiple industries including foodservice, restaurant delivery and carryout, food processing, grocery and retail, and industrial sectors. Novolex manufacturing and
Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are
Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are
The application window is expected to close on: 09/30/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received. This is a hybrid role with three
The application window is expected to close on: 09/30/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received. This position requires that you live within