Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomms Integrated Circuits (IC) Packaging organization and represents a senior leadership role within the Mechanical Simulation function. The Director will lead a team of
pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission—to enhance Murata’s world-class capabilities with high-performance semiconductors. With
SummaryImagine what you could do here. At Apple, new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and theres no telling what you
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product introductions for
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomm’s Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomms current/future chipsets using FEA expertise, working closely with
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: The Qualcomm Package Electrical Team has an opening in the areas of signal integrity and power integrity. The candidate will work with package and IC designers to find
Company:Qualcomm Technologies, Inc. Job Area:Engineering Services Group, Engineering Services Group Engineering Technician General Summary: The Package Process & Technology team is seeking a highly skilled Engineering Technician to support advanced semiconductor package development through hands-on SMT assembly, process optimization, and
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications. The qualified individual will develop thermal solutions for server products at
Who We Are: Neurocrine Biosciences is a leading biopharmaceutical company with a simple purpose: to relieve suffering for people with great needs. We are dedicated to discovering, developing and commercializing life-changing treatments for patients with under-addressed
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This individual independently plans, performs the moderately-defined responsibility for new product development risk analysis, characterization, and mitigation of electronic packages working with internal design and engineering teams and external
Shield AI is a venture-backed defense-tech company with the mission of protecting service members and civilians with intelligent systems. Its products include Hivemind autonomy software, V-BAT and X-BAT aircraft, and Aechelon simulation and synthetic reality technologies.
Who We Are At Firestorm, we are building the future of expeditionary defense manufacturing and autonomous systems. Modern conflict has exposed a fundamental problem: the systems needed most by operators are often too expensive, too slow
Introduction to the role ASML US, including its affiliates and subsidiaries, bring together the most creative minds in science and technology to develop lithography machines that are key to producing faster, cheaper, more energy-efficient microchips. We
Shield AI is a venture-backed defense-tech company with the mission of protecting service members and civilians with intelligent systems. Its products include Hivemind autonomy software, V-BAT and X-BAT aircraft, and Aechelon simulation and synthetic reality technologies.
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomm’s Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomms current/future chipsets using FEA expertise, working closely with
Career Area:Operations Job Description: Your Work Shapes the World at Caterpillar Inc. When you join Caterpillar, youre joining a global team who cares not just about the work we do – but also about each other.
Senior Manager of Mechanical Engineering Shield AI is seeking a Senior Manager of Mechanical Engineering to build and lead the team responsible for all mechanical design, thermal, and harnessing in the X-BAT aircraft and ground vehicle. You will
Localization Manager - Print Documentation, Localization & Release Engineering Apple is where innovation meets global impact. Join the team dedicated to helping international users learn, discover, and get the most out of their Apple products. Our team
Description WARNING about fake job posting scams. There has been a recent wave of scams whereby third parties post fake job openings using a bogus email address that resembles [email protected]. Under the guise of asking you
Description WARNING about fake job posting scams. There has been a recent wave of scams whereby third parties post fake job openings using a bogus email address that resembles [email protected]. Under the guise of asking you