Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and
Position Overview FUJIFILM Electronic Materials, U.S.A., Inc., is a global leader in chemical solutions which enable the semiconductor industry and the digital universe. We have an exciting opportunity at our Mesa, Arizona facility for a Controls
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into
Company Description Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent
We are searching for a Power Discrete New Product Engineering Technical Leader (MTS) to drive all product-level engineering activities for Si, SiC discrete devices in automotive and industrial applications at onsemi. This is a high-priority business growth area
About IonQ: IonQ, Inc. [NYSE: IONQ] is the world’s leading quantum platform and merchant supplier - delivering integrated quantum solutions across computing, networking, sensing, and security. IonQ’s newest generation of quantum computers, the IonQ Tempo, is
Position Summary Amkor is looking to fill a Product Management position for the Advanced Flip Chip Packaging Assembly Business Unit in Tempe, AZ. This position includes cross functional management and direct customer interactions for new product development,
Amkor is seeking a Product Manager for the Advanced Flip Chip Packaging Assembly Business Unit in Tempe, AZ. This role blends deep technical knowledge with project management, strategic planning and direct customer interactions for new product development,
Senior Manager Or Architect High Power/High Voltage Products Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power
Account Manager, Protective Packaging (Cushioning) The Account Manager, Protective (Cushioning) Solutions is responsible for driving profitable growth within a defined territory or portfolio by delivering innovative, value-based packaging solutions. This role partners closely with customers to understand their
Job Title Intel Foundry Program Leader Job Description The Role and Impact Intel Foundry is building the operating discipline needed to deliver complex manufacturing, packaging, and technology commitments with speed, quality, and confidence. This role drives the
Product Management Position Amkor Technology, Inc. is the worlds largest U.S. headquartered OSAT and a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint
IT End User Support Client Engineering Manager VIAVI (NASDAQ: VIAV) is a global provider of network test, monitoring and assurance solutions for telecommunications, cloud, enterprises, first responders, military, aerospace, and railway. VIAVI is also a leader in
Facilities Engineering Manager FUJIFILM Electronic Materials, U.S.A., Inc., is a global leader in chemical solutions which enable the semiconductor industry and the digital universe. We have an exciting opportunity at our Mesa, AZ facility for a Facilities
Manufacturing Operations Manager Advanced Packaging Intel is one of the worlds leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and artificial intelligence. With a legacy of over 50 years of technological breakthroughs, Intels
Manager, Product Application Engineering ReRAM / NVM Solutions Location: Scottsdale, AZ Role Overview The Product Applications Engineering Manager leads the system definition, customer adoption, and product shaping of ReRAM based NVM solutions. This role serves as the critical
Job Description: Develops and designs packaging equipment and materials for safe, convenient and attractive transport of goods under a variety of conditions. Analyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience,
Job Description Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, WLCSP, multi-chip module with substrate or embedded die/capacitor and power device packaging. Develop Cu RDL with seed layer on
Position Overview The Field Service Technician – Level 3 will report to the Regional Support Manager and will be responsible for the service and maintenance of either multiple product lines that the GCD service team supports
Build our future together: At Regeneron, we use science and innovation to develop life-changing medicines for people with serious diseases. We are seeking a Senior Director, Manufacturing Technical Services (MTS) to join our team, supporting our