Wafer Bond Process Engineer Description - HP is seeking a highly motivated Process Engineer to provide technical leadership for wafer bonding technologies supporting both high-volume manufacturing and next-generation MEMS product development. This role is responsible for sustaining and improving existing
PageWide Industrial Customer Program Manager (CPM) Description - Job Summary PageWide Industrial (PWI) needs your leadership and passion to help our customers grow! We have revolutionized the digital web press industry by offering full-color, variable data
MEMS Engineering Manager 1 Description - Major Responsibilities: This manager will be responsible for a MEMS process/product development engineering team that innovates, characterizes, and stabilizes fabrication processes used to produce inkjet components and other microfluidic devices. Our