Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops media and collaterals for assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intels roadmap
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Company Description Responsible for defining, selecting and documenting Renesas’ process technology nodes by working closely with foundry partners. Deliver appropriate technical support to product design and layout Engineers in order to ensure successful and reliable manufacturing of Renesas
Job Details: Job Description: Join Intel as a Process Integration and Yield Engineer, where you will play a pivotal role in driving yield improvements, quality standards, and manufacturing excellence across Intels cutting-edge semiconductor technologies. In this critical position,
Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology
Job Details: Job Description: Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intels next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor
Who We Are Here at Advantest, we are blending precision manufacturing with cutting-edge tech to revolutionize the semiconductor game. Advantest is leveraging Industry 4.0 to bring together Innovation, Cutting-Edge Technology, Machining Automation, and Smart Manufacturing as
Job Details: Job Description: The Advance Packaging Technology Development APTD SWA is at the center of making Intel Foundrys and APTMs advanced package substrate roadmap a reality. We do this by collaborating with our internal Integration team
Job Details: Job Description: The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique opportunity
Job Details: Job Description: The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal Compression Bonding (TCB) technologies. The successful candidate develops
Job Details: Job Description: The Role and Impact As a Packaging Quality and Reliability Engineer, you will play a critical role in Intels mission to deliver world-class semiconductor technologies. In this position, you will drive quality and
Job Details: Job Description: Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of
Quality Engineer (Supplier Quality Focus) Location: Chandler, Arizona Reports To: Director of Quality U.S. Citizenship Requirement: Due to U.S. Government contract requirements applicable to this position, only U.S. citizens are eligible for employment in this role. About
Company Description Renesas Electronics is seeking a skilled and motivated Senior Digital Design Engineer to join our growing hardware development team in Chandler, AZ. In this role, you will be responsible for designing power and area-optimized digital circuits
Summary: VIAVI (NASDAQ: VIAV) is a global provider of network test, monitoring and assurance solutions for telecommunications, cloud, enterprises, first responders, military, aerospace, and railway. VIAVI is also a leader in light management technologies for 3D
Job Details: Job Description: The Stress Testing and Reliability Laboratory is seeking a motivated, hands-on engineer to join our Environmental Stress Tool Engineering team. In this role, you will play a key part in advancing Intels next-generation
Requisition ID: 295751 Relocation Authorized: National - Family Telework Type: Full-Time Office/Project Work Location: Chandler, AZ Extraordinary teams building inspiring projects: Since 1898, we have helped customers complete more than 25,000 projects in 160 countries on
Credit Acceptance is proud to be an award-winning company recognized both locally and nationally across multiple workplace categories. Our world-class culture is shaped by dedicated team members who are driven to succeed as professionals individually and
Company Description To take technical lead or significant contribution of Analog design of complex power management integrated circuits. You will be expected to support analog team members with guidance in Analog best practice, drive identification and
LotusWorks is an Engineering Services provider specializing in managing Commissioning, Construction Services, Calibration, Operations & Maintenance scopes of work within global manufacturing facilities. LotusWorks operates globally across EMEA and North America partnering with the worlds leading