Job Description Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, WLCSP, multi-chip module with substrate or embedded die/capacitor and power device packaging. Develop Cu RDL with seed layer
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization
Position Summary Amkor is looking to fill a Product Management position for the Advanced Flip Chip Packaging Assembly Business Unit in Tempe, AZ. This position includes cross functional management and direct customer interactions for new product