Job Details: Job Description: We are seeking a proactive and detail-oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This individual will play a critical role
Requisition Number: 76113 The company built on breakthroughs. Join us. Corning is one of the world’s leading innovators in glass, ceramic, and materials science. From the depths of the ocean to the farthest reaches of space,
Job Details: Job Description: The Stress Testing and Reliability Laboratory is seeking a motivated, hands-on engineer to join our Environmental Stress Tool Engineering team. In this role, you will play a key part in advancing Intels
Job Details: Job Description: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology
Semiconductor Market Sector Sales Engineer (Austin, Texas) Composed of Chromalox, Durex Industries, Vulcanic, and Thermocoax businesses, Electrical Thermal Solutions (ETS), part of Spirax Group, creates electrical process heating and temperature management solutions, including industrial heaters and systems,
Semiconductor Market Sector Sales Engineer (Austin, Texas) Composed of Chromalox, Durex Industries, Vulcanic, and Thermocoax businesses, Electrical Thermal Solutions (ETS), part of Spirax Group, creates electrical process heating and temperature management solutions, including industrial heaters and systems,
Job Details: Job Description: The Role and Impact Intel Foundry is building the operating discipline needed to deliver complex manufacturing, packaging, and technology commitments with speed, quality, and confidence. This role drives the systems, signals, and execution
WORLD WIDE PROFESSIONAL SOLUTIONS is a project solutions organization committed to implementing lean constructions, collaborative contracting, and execution approaches to enable breakthroughs in performance. We are seeking a highly skilled and motivated Area Superintendent to join
Job Details: Job Description: Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intels roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes
MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies
Job Details: Job Description: Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intels next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor packaging, enabling
Job Details: Job Description: We are seeking an experienced Silicon Packaging Design Engineer with a strong background in board design and package-board integration to drive the end-to-end development of test boards supporting advanced silicon package validation and
Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD)
Job Details: Job Description: Intel Chandler, Arizona Ocotillo Technology Fabrication (OTF) is part of Intel Foundrys Manufacturing and Supply Chain group (FMSC) and is responsible for the high-volume production of Intel silicon using some of the
Company OverviewKLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device
Eliyan is building NuLink, a proprietary die-to-die chiplet interconnect fabric purpose-built for AI infrastructure at hyperscale. As Eliyan expands into co-packaged optics (CPO), the VP of Optical Product Development owns the product strategy for integrating third-party
MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies
Job Details: Job Description: Join Intel Foundry Construction and Sourcing (FCS) in building the worlds largest semiconductor manufacturing factories across the globe. The future is what we build. The scope of our work includes but is not
Job Details: Job Description: The Role and Impact As a Module Equipment Technician, you will play a critical role in Intels high-tech manufacturing process, ensuring our tools are optimized for world-class production. Your contributions will directly
Job Details: Job Description: The Role and Impact As a Facilities Mechanical Technician, you will play a pivotal role in maintaining and optimizing Intels state-of-the-art facilities. Your work will directly support Intels mission to shape the