Wafer Bond Process Engineer Description - HP is seeking a highly motivated Process Engineer to provide technical leadership for wafer bonding technologies supporting both high-volume manufacturing and next-generation MEMS product development. This role is responsible for sustaining and improving
MEMS Wafer Integration Engineer Description - Job Summary The MEMS organization is looking for an Expert level Silicon Wafer Fabrication Integration Engineer. This role is responsible for the end-to-end integration of silicon wafer fabrication processes supporting
Business Systems Manager Description - Position Summary Lead financial planning, manufacturing cost modeling, capital forecasting, and financial systems for MTD (MEMS Technology Development) and associated labs. Serve as a strategic partner to MTD labs, and executive leadership