Company Description Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. As the industry shifts toward heterogeneous integration, we are leading the charge
Location:(STS) Pittsburgh - Generic Job ID: R0132348 Date Posted:2026-05-28 Company Name:HITACHI RAIL STS USA, INC. Profession (Job Category):Engineering & Science Job Schedule: Full time Remote:No About Us A career at Hitachi Rail will help create a
Company Description Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. As the industry shifts toward heterogeneous integration, we are leading the charge
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Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring
Minimum qualifications: Bachelors degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience. 4 years of experience in chip package design/layout using Cadence allegro package designer (APD) or Mentor Expedition. Experience
Technical and customer support for the qualification of SiC die sales and development SiC wafer die sales is a main focus for onsemi and is critical to its future. This opportunity is for those who are
Company Description Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. As the industry shifts toward heterogeneous integration, Renesas is expanding its advanced
Here at Scout Motors, were carrying forward the heritage of one of the most iconic American vehicles in history. A vehicle dating back to 1960. One that forged the path for future generations of rugged SUVs
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking,
Company Description Renesas is a global semiconductor company delivering embedded solutions across microcontrollers, analog, power, and SoC products. Our technologies support critical applications across automotive, industrial, infrastructure, and IoT markets, helping enable smarter, safer, and more
Company Description At Renesas Electronics, we are a global leader in microcontrollers, analog, power, and SoC products, delivering trusted embedded design innovation that shapes the way we live, work, and connect. As a cornerstone of our
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented
SW Engineer Package Layout Design 3D-IC Solutions Siemens EDA is a global technology leader in Electronic Design Automation (EDA) software, dedicated to pushing the boundaries of semiconductor design. As a Software Engineer, you will contribute to developing innovative software
Position Overview We are seeking a highly motivated Chiplet Package Design Engineer to drive the development of advanced packaging solutions for next-generation semiconductor products. This role focuses on 2.5D and 3D heterogeneous integration, enabling high-performance computing, AI, networking,
Position Overview We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer chiplet-based product development using Rapidus advanced packaging technologies. This role serves as the primary
Life changing therapies. Global impact. Bridge to thousands of biopharma companies and their patients. We are PCI. Our investment is in People who make an impact, drive progress and create a better tomorrow. Our strategy includes
Our client is seeking an experienced Package Design Engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance
The Aerospace Corporation is the trusted partner to the nation’s space programs, solving the hardest problems and providing unmatched technical expertise. As the operator of a federally funded research and development center (FFRDC), we are broadly