Job Details: Job Description: This role will support root cause determination of assembled package yield loss and in-line failures on a back of week compressed shift. The engineer on shift will be responsible for technical functions such as
SummaryOur Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple’s internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We’re looking for a Package Design Engineer to drive the
You’re sooo Benefit! The Associate Package Development Engineer will primarily focus on developing packaging components for promotional, holiday/seasonal and sampling projects. Such projects are packaging one or more finished good items in a special/custom packaging design made from
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented
Minimum qualifications: Bachelors degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience. 8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition. Experience in
Job Details: Job Description: About Altera At Altera, our independence as the world’s largest pure‑play FPGA solutions provider gives us the focus, speed, and agility to innovate without compromise. With more than four decades of industry‑leading
Waymo is an autonomous driving technology company with the mission to be the worlds most trusted driver. Since its start as the Google Self-Driving Car Project in 2009, Waymo has focused on building the Waymo Driver—The
Job Description Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, WLCSP, multi-chip module with substrate or embedded die/capacitor and power device packaging. Develop Cu RDL with seed layer
The future starts here! Are you ready to join NXP in Package Innovation? The Package Innovation organization is responsible for the design of new packaging concepts and the development of new packaging technologies and assembly processes. It partners
Job Description The Package Development Engineer is responsible for developing, qualifying, and industrializing semiconductor package solutions that meet product performance, reliability, manufacturability, cost, and schedule requirements. This role works closely with cross-functional teams, including silicon design, package design, manufacturing, reliability,
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization
We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradynes test technology ensures your device works right the first time, every time! Our portfolio of
Minimum qualifications: Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience. 10 years of experience with SI/PI design for chip/package or system PCB. Experience in industry Signal integrity and
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and
Company Description Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. As the industry shifts toward heterogeneous integration, Renesas is expanding its advanced
Manager, Package Engineer Ocean Spray is hiring for a Manager, Package Engineer! Were a team of farmers, thinkers, creators, and doers. Whatever your title, whatever your role it always comes back to this: were a farmer-owned co-op where everyone rolls
Life changing therapies. Global impact. Bridge to thousands of biopharma companies and their patients. We are PCI. Our investment is in People who make an impact, drive progress and create a better tomorrow. Our strategy includes
System Safety Engineer, Mid The Opportunity: Are you looking for an opportunity to combine your technical skills with big picture thinking to make an impact on system safety? Our team supports senior-level DoW and service personnel with
MBSE & Digital Threads Engineer The Opportunity: You are a forward-thinking digital engineer, passionate about solving complex problems through a systematic approach, strong technical skills, and data-centric analysis to answer critical questions. You excel at working independently while
Post Quantum Cryptography Engineer The Opportunity: Work alongside cryptographers, mathematicians, and physicists in support of all of quantum information sciences. Specifically, you will use systems architecture, network engineering, or software development skill sets to implement post-quantum cryptography