Annapurna Labs (U.S.) Inc. designs silicon and software for cloud solutions and accelerates innovation. We seek a Sr. Package Layout Engineer to lead end-to-end physical design of advanced IC packages for next-generation machine learning and data center ASICs.
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago-even yesterday. Our custom chips, accelerators, and
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting‑edge advanced packaging for the semiconductor industry by combining patterning and metallization into
Location: Scottsdale, Arizona, United States Join Axon and be a Force for Good. What Youll Do Update in-market circuit designs to address component obsolescence, approved component substitutions, second-source requests, cost reduction opportunities, and other post-launch design
Job Description We are seeking a Principal Device Design Engineer to develop cutting‑edge switching power MOSFETs for 12V to 80V applications. You will participate in the full product cycle, from the conception of the architecture through
Job Description In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. You will play a critical role in designing and delivering next-generation, high-performance semiconductor package solutions, including power
Scottsdale, AZ, United States Job Description Location: Scottsdale, AZ Role Overview The Product Applications Engineer will serve as a technical expert and customer advocate for our Non-Volatile Memory (NVM) portfolio, specifically EEPROM and ReRAM-based products. This
Company Description Renesas Electronics Americas (REA) is a dynamic, multi-cultural tech company where employees can learn, mentor and thrive. REA brings together the strong financial foundation of a multi-billion dollar global operation and the flexibility and
Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering
Company Description Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to
Company Description Responsible for defining, selecting and documenting Renesas’ process technology nodes by working closely with foundry partners. Deliver appropriate technical support to product design and layout Engineers in order to ensure successful and reliable manufacturing of
Job Description HYBRID MUST HAVE - Experience on Teradyne Flex test systems and IG-XL The Custom and Industrial Power unit at Renesas Semiconductor is seeking to hire a Senior Test Engineer at the Chandler, AZ site.