About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into
IC Resources is partnering with a Global Leader in the Semiconductor Industry to hire a Sr. Product Engineer (Power Systems/Packaging) for AI power products. This hybrid role is based in Tempe, AZ or Austin, TX, with local candidates
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting‑edge advanced packaging for the semiconductor industry by combining patterning and metallization into a
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago-even yesterday. Our custom chips, accelerators, and
Company Description Renesas Electronics Americas (REA) is a dynamic, multi-cultural tech company where employees can learn, mentor and thrive. REA brings together the strong financial foundation of a multi-billion dollar global operation and the flexibility and
Position Overview Who We Are FUJIFILM Electronic Materials, U.S.A., Inc., is a global leader in chemical solutions which enable the semiconductor industry and the digital universe. We have an exciting opportunity at our Mesa, Arizona facility
Job Description Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, WLCSP, multi-chip module with substrate or embedded die/capacitor and power device packaging. Develop Cu RDL with seed layer on
Position Summary Amkor is currently seeking a Director, Chiplets and FCBGA for our Tempe, AZ office. The primary function of this position is program management for development of advanced chiplet-based IC Packages including HDFO (High Density Fan-out)
Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, WLCSP, multi-chip module with substrate or embedded die/capacitor and power device packaging. Develop Cu RDL with seed layer on IC wafer and
Scottsdale, AZ, United StatesJob Description Location: Scottsdale, AZRole Overview The Product Applications Engineer will serve as a technical expert and customer advocate for our Non-Volatile Memory (NVM) portfolio, specifically EEPROM and ReRAM-based products. This role combines
Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint
Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint
Job Description We are seeking a Principal Device Design Engineer to develop cutting‑edge switching power MOSFETs for 12V to 80V applications. You will participate in the full product cycle, from the conception of the architecture through
Job Description In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. You will play a critical role in designing and delivering next-generation, high-performance semiconductor package solutions, including power
We are very excited about our exclusive partnership with a Global Leader in the Semiconductor Industry in their search for a Sr. Product Engineer (Power Systems/Packaging) for their new AI Power Products. This is an amazing opportunity
Vice President of Sales (CEO Successor Track) (m/f/d) The company SCHMID Systems Inc. is looking for an Vice President of Sales (CEO Successor Track) (m/f/d). About SCHMID: Founded in 1864, the SCHMID Group is a global
A leading semiconductor solutions provider is seeking a Director, Chiplets and FCBGA, for their Tempe, AZ office. This role involves program management for advanced chiplet-based IC packages and coordinating with Tier 1 customers. Candidates should possess a
Manager, Product Application Engineering ReRAM / NVM Solutions Location: Scottsdale, AZ Role Overview The Product Applications Engineering Manager leads the system definition, customer adoption, and product shaping of ReRAM based NVM solutions. This role serves as