Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product introductions
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomm’s Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomms current/future chipsets using FEA expertise,
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomms Integrated Circuits (IC) Packaging organization and represents a senior leadership role within the Mechanical Simulation function. The Director will lead a
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This position is part of Qualcomm’s Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomms current/future chipsets using FEA expertise,
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: The Qualcomm Package Electrical Team has an opening in the areas of signal integrity and power integrity. The candidate will work with package and IC designers
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Packaging Engineering General Summary: This individual independently plans, performs the moderately-defined responsibility for new product development risk analysis, characterization, and mitigation of electronic packages working with internal design and
At Elevate Semiconductor, we empower semiconductor and system test customers by creating world class ICs that tackle the industry’s most complex automated test equipment challenges. Our innovative team designs the lowest power, highest density solutions to reduce
SummaryImagine what you could do here. At Apple, new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and theres no telling what you
Company:Qualcomm Technologies, Inc. Job Area:Engineering Services Group, Engineering Services Group CAD Component General Summary: Qualcomm is a company of inventors that unlocked 5G & 6G, ushering in an age of rapid acceleration in connectivity and new
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: Creates test plans, test procedures, manufacturing solutions, HW designs for leading-edge mid-high power ASIC products in the most advanced process technologies. Performs silicon design
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: Product and Test Engineering (PTE) is looking for a Digital Test Engineers who will create test solutions in support of New Product Introduction (Silicon
Company:Qualcomm Technologies, Inc. Job Area:Engineering Services Group, Engineering Services Group CAD Component General Summary: Qualcomm is a company of inventors that unlocked 5G & 6G ushering in an age of rapid acceleration in connectivity and new
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: We are seeking a senior-level Low Power Chip Architect / System Engineer with deep expertise in mixed-signal IC and system design and a proven record
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group ASICS Engineering General Summary: The Senior Director of Low Power Analog & Mixed-Signal Technologist will serve as the key technology and organizational leader responsible for defining and executing
Company:Qualcomm Technologies, Inc. Job Area:Engineering Group, Engineering Group Hardware Engineering General Summary: Job Description Plans, designs, and develops electronic systems, circuits, components, integrated circuitry, mechanical systems, equipment and packaging, optical systems, and/or DSP systems. Conducts simulations and
Company:Qualcomm Technologies, Inc. Job Area:Engineering Services Group, Engineering Services Group PWB Design General Summary: Job Overview Qualcomm is a company of inventors that unlocked 5G & 6G, ushering in an age of rapid acceleration in connectivity
SummarySilicon Photonics (SiPh) and optical I/O are rapidly becoming foundational to next-generation data center SoCs, unlocking the bandwidth, energy efficiency, and reach that electrical interconnects can no longer sustain. This is a pioneering opportunity to help