We are seeking a Staff/Principal Solutions Architect to define and lead the technical strategy for semiconductor test. This covers wafer and package test operations from start to finish. This senior individual contributor role is central to our
PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant
PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant
PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
About the Team: OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions
Come join Analog Devices (ADI) – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest
Minimum qualifications: Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience. 5 years of experience with package development for high volume production. 5 years of experience with advance
Strategic Account Executive Vinci is building a new compute layer for engineering: a physics foundation model that makes high-fidelity physics continuously accessible across the hardware development lifecycle. Today, the worlds most advanced semiconductors are still designed using
Product Line Manager (PLM) Director for Advanced Packaging & Metrology KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone,
Eliyan Principal Technical Program Manager ON-SITE (BAY AREA) Join the leading chiplet startup! As an Eliyan Principal Technical Program Manager, you will be working at a fast-paced early-stage startup creating technologies that fuel tomorrows chiplet based
Executive Director of R&D Engineering for 3DIC-Advance Packaging Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and
Position Overview We are seeking a highly skilled ADK (Assembly Design Kit) Development Engineer to lead the creation, integration, and validation of design enablement infrastructure for 2.5D/3D advanced packaging, including chiplet-based architectures, silicon interposers, and heterogeneous integration
Position Overview We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer chiplet-based product development using Rapidus advanced packaging technologies. This role serves as the primary
Product Line Management IV (E4) The Applied Global Services (AGS) Packaging Service Business Unit (SBU) is seeking an ambitious candidate that possesses strong technical knowledge with Wafer level packaging semiconductor equipment in the areas of hardware design, process engineering